JPH0222987Y2 - - Google Patents

Info

Publication number
JPH0222987Y2
JPH0222987Y2 JP1981019198U JP1919881U JPH0222987Y2 JP H0222987 Y2 JPH0222987 Y2 JP H0222987Y2 JP 1981019198 U JP1981019198 U JP 1981019198U JP 1919881 U JP1919881 U JP 1919881U JP H0222987 Y2 JPH0222987 Y2 JP H0222987Y2
Authority
JP
Japan
Prior art keywords
lead frame
rail
lead
feed
shows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981019198U
Other languages
English (en)
Japanese (ja)
Other versions
JPS57132445U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981019198U priority Critical patent/JPH0222987Y2/ja
Publication of JPS57132445U publication Critical patent/JPS57132445U/ja
Application granted granted Critical
Publication of JPH0222987Y2 publication Critical patent/JPH0222987Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1981019198U 1981-02-13 1981-02-13 Expired JPH0222987Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981019198U JPH0222987Y2 (en]) 1981-02-13 1981-02-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981019198U JPH0222987Y2 (en]) 1981-02-13 1981-02-13

Publications (2)

Publication Number Publication Date
JPS57132445U JPS57132445U (en]) 1982-08-18
JPH0222987Y2 true JPH0222987Y2 (en]) 1990-06-21

Family

ID=29817142

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981019198U Expired JPH0222987Y2 (en]) 1981-02-13 1981-02-13

Country Status (1)

Country Link
JP (1) JPH0222987Y2 (en])

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5724413Y2 (en]) * 1977-02-24 1982-05-27
JPS5512747A (en) * 1978-07-12 1980-01-29 Matsushita Electronics Corp Lead frame detecting device
JPS582895B2 (ja) * 1978-10-03 1983-01-19 沖電気工業株式会社 用紙の重ね送り検知装置
JPS55163856A (en) * 1979-06-06 1980-12-20 Toshiba Corp Apparatus for positioning semiconductor device enclosure

Also Published As

Publication number Publication date
JPS57132445U (en]) 1982-08-18

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